Bga Emmc Ic Reballing Stencil Plate

268g 9 5oz package list. Use a soldering iron and desoldering wire or wick. 2020 popular rebalding direct heat stencil qianli stencil bga iphon trends in tools electronic components supplies cellphones telecommunications consumer electronics with bga ic reballing stencil and rebalding direct heat stencil qianli stencil bga iphon.

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Bga emmc ic reballing stencil plate. Now clean the solder from the bottom of the ic and the pcb where the ic was soldered. Bga reballing stencil plate tin iphone x xs xr xs max 8 7 6s 6 5 5s 5c se 4 4s. Now select the right size of the ic depending on the number of balls from the stencil supplied with the kit. For 169 emmc bga reballing stencil tin plate kmsjs000km b308 bga direct heating stencil us 0 85 piece.

Desolder and remove the bga ic from the pcb. Ic repair bga reballing stencil template for iphone 6 6 6s 6s plus 7 7 8 x ipad. These stencils were made by high quality material can be heated by the hot air machine it is easy and quickly for reballing the bga ic. 3pcs x bga stencils for 0 35mm solder ball 2pcs x bga stencils for 0 4mm solder ball.

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